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Dongguan Xingqiang Circuit Board Technology Co., Ltd.
Dongguan Xingqiang Circuit Board Technology Co., Ltd.
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Reliable HDI PCB with Signal Integrity, Low EMI, and Miniaturization Design for High-Density Interconnect Applications

Dongguan Xingqiang Circuit Board Technology Co., Ltd.
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Reliable HDI PCB with Signal Integrity, Low EMI, and Miniaturization Design for High-Density Interconnect Applications

Brand Name : Xingqiang

Model Number : As Per Customer's Model

Place Of Origin : China

Certification : ISO 9001 / RoHS /UL / IATF 16949 (automotive)

MOQ : Sample,1 Pc(5 Square Meters)

Price : Based on Gerber Files

Packaging Details : Packed As Per Customer

Payment Terms : ,T/T,Western Union

Supply Ability : 100000㎡/Month

Delivery Time : NA

Productname : High Density Interconnect PCB

Layers : 1-30

Min.hole Size : 0.1mm

Material : High Tg FR-4

Board Thinkness : 0.2-5.0mm

Minimum Trace Width : 3 Mils (0.075 Mm)

Minimum Line Space : 3mil (0.075mm)

Surface Finishing : OSP/ENIG/ENEPIG

Quotation Requirement : Gerber Files or BOM List

Solder Mask : Green,Red,Blue,White,Black,Yellow

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Reliable HDI Printed Circuit Board Optimized for Signal Integrity and Low EMI
HDI PCBs for Modern Electronic Equipment

An HDI PCB (High-Density Interconnector Printed Circuit Board) is a circuit board with a significantly higher wiring density per unit area compared to conventional PCBs. It achieves this density by utilizing microvias (tiny, often laser-drilled holes), blind and buried vias, and finer lines and spaces. HDI technology is fundamental for miniaturizing modern electronic devices, such as smartphones, tablets, and high-end medical equipment, enabling complex circuitry and enhanced electrical performance within a smaller, lighter form factor.

Key Advantages of HDI PCBs
Advantage Core Benefit Enabling Technology
Miniaturization Reduces board size and product weight Finer Lines/Spaces and smaller pads
Electrical Performance Improves signal quality for high-speed operation Short Microvias (Blind/Buried Vias)
Design Flexibility Allows for dense component placement and complex routing Sequential Build-up (SBU) process
Reliability Higher durability under thermal stress Shallow Microvias reduce mechanical stress
Frequently Asked Questions
Q: How many layers can your circuit boards provide?
A: We typically provide 1-30 layer boards, and in special cases, we can stack more layers.
Q: Do your circuit boards support customization?
A: Yes, we support customized designs. You can send us your Gerber files and BOM list, and we will provide you with an accurate quote based on the information and market conditions.
Q: What do Gerber files typically contain?
A: Normally Gerber files include: PCB Types, Product thickness, Ink color, Surface treatment process and if SMT processing is required, component BOM and tag drawing are also required.
Q: What is your minimum order quantity for PCB boards?
A: Our minimum order quantity is 1 piece (5 square meters), the larger the quantity, the bigger the discount.
Q: Do you have relevant certification certificates to support this?
A: We hold numerous important certifications, including ISO, UL, CE, and RoHS. All products undergo rigorous quality testing.
Q: What payment method do you usually use?
A: For small orders, samples, or urgent payments, we accept Western Union. For large orders, we recommend T/T, which ensures the safety of both parties.
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Reliable HDI PCB with Signal Integrity, Low EMI, and Miniaturization Design for High-Density Interconnect Applications
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Reliable HDI PCB with Signal Integrity, Low EMI, and Miniaturization Design for High-Density Interconnect Applications
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Reliable HDI PCB with Signal Integrity, Low EMI, and Miniaturization Design for High-Density Interconnect Applications
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Reliable HDI PCB with Signal Integrity, Low EMI, and Miniaturization Design for High-Density Interconnect Applications
Reliable HDI PCB with Signal Integrity, Low EMI, and Miniaturization Design for High-Density Interconnect Applications

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HDI PCB for signal integrity

      

Low EMI printed circuit board

      

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