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Brand Name : Xingqiang
Model Number : As Per Customer's Model
Place Of Origin : China
Certification : ISO 9001 / RoHS /UL / IATF 16949 (automotive)
MOQ : Sample,1 Pc(5 Square Meters)
Price : Based on Gerber Files
Packaging Details : Packed As Per Customer
Payment Terms : ,T/T,Western Union
Supply Ability : 100000㎡/Month
Delivery Time : NA
Productname : High Density Interconnect PCB
Layers : 1-30
Min.hole Size : 0.1mm
Material : High Tg FR-4
Board Thinkness : 0.2-5.0mm
Minimum Trace Width : 3 Mils (0.075 Mm)
Minimum Line Space : 3mil (0.075mm)
Surface Finishing : OSP/ENIG/ENEPIG
Quotation Requirement : Gerber Files or BOM List
Solder Mask : Green,Red,Blue,White,Black,Yellow
An HDI PCB (High-Density Interconnector Printed Circuit Board) is a circuit board with a significantly higher wiring density per unit area compared to conventional PCBs. It achieves this density by utilizing microvias (tiny, often laser-drilled holes), blind and buried vias, and finer lines and spaces. HDI technology is fundamental for miniaturizing modern electronic devices, such as smartphones, tablets, and high-end medical equipment, enabling complex circuitry and enhanced electrical performance within a smaller, lighter form factor.
| Advantage | Core Benefit | Enabling Technology |
|---|---|---|
| Miniaturization | Reduces board size and product weight | Finer Lines/Spaces and smaller pads |
| Electrical Performance | Improves signal quality for high-speed operation | Short Microvias (Blind/Buried Vias) |
| Design Flexibility | Allows for dense component placement and complex routing | Sequential Build-up (SBU) process |
| Reliability | Higher durability under thermal stress | Shallow Microvias reduce mechanical stress |
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Reliable HDI PCB with Signal Integrity, Low EMI, and Miniaturization Design for High-Density Interconnect Applications Images |