Product Description:
HD PCB (High Density PCB) is an advanced type of printed circuit board designed for high component density, miniaturization, and high-performance electronic devices.Compared to traditional PCBs, it features ultra-fine copper traces (line widths/spacings usually ≤ 0.1mm, even down to 0.03mm), tiny microvias (diameter ≤ 0.15mm, in blind/buried/stacked designs), and more layers (often 8–40+ layers). It also uses specialized materials (e.g., high-heat-resistant high-Tg FR-4, flexible polyimide) and strict manufacturing precision to support dense component mounting (e.g., fine-pitch chips).Widely used in smartphones, wearables, EVs, medical implants, and 5G equipment, it enables smaller device sizes, stable high-speed signal transmission, and reliable operation in harsh environments.
Advantages :
1. Enables device miniaturization: Ultra-fine traces, microvias, and multi-layer designs let more components fit in small spaces, supporting slim/portable devices (e.g., smartwatches, thin smartphones).
2. Boosts signal performance: Low-loss materials and short microvia paths reduce signal interference and weakening, critical for high-speed/high-frequency devices (e.g., 5G modems, LiDAR).
3. Enhances reliability: Fewer connectors (replacing multiple traditional PCBs) and harsh-environment-resistant substrates (e.g., high-Tg FR-4) lower failure risks, suitable for autos/aerospace.
4. Frees up design flexibility: Supports flexible structures (foldable phones) and stacked components (e.g., memory on CPU), easing integration of complex functions.
5. Cuts long-term costs: Though upfront manufacturing is pricier, smaller device size, fewer assembly steps, and less maintenance reduce overall expenses.
How is the manufacturing process of HDPCB?1.Substrate & Pre-treatment: Traditional PCBs use low-cost standard FR-4 (low Tg); HDPCBs adopt high-performance materials (high-Tg FR-4, polyimide, PTFE) with pre-treatment (e.g., plasma cleaning) for better adhesion and environmental resistance.2. Trace Patterning: Traditional PCBs use standard photolithography for ≥0.15mm traces; HDPCBs rely on high-resolution laser direct imaging (LDI) to make ≤0.03mm fine traces, with thinner copper layers (0.5–1 oz) and precise micro-etching.3. Via Drilling: Traditional PCBs use mechanical drilling for ≥0.2mm through-holes; HDPCBs use laser drilling to create ≤0.15mm microvias (blind/buried/stacked), saving space.4. Layer Lamination: Traditional PCBs laminate 2–4 layers with loose alignment (≥0.05mm); HDPCBs bond 8–40+ layers via high-precision alignment (≤0.01mm) and controlled heat/pressure to avoid warping.5. Component Mounting: Traditional PCBs use through-hole mounting or standard SMT (≥0.8mm pitch); HDPCBs use fine-pitch SMT (≤0.5mm pitch) with high-accuracy placement machines, plus nitrogen reflow to prevent solder defects.6. QC: Traditional PCBs use basic AOI; HDPCBs add 3D AOI, X-ray inspection (for microvias), and signal integrity testing to detect tiny defects.
